FILM FORMING APPARATUS AND METHOD FOR CONTROLLING FILM FORMING APPARATUS

The invention relates to a film forming apparatus and a control method of the film forming apparatus. Efficient operation of a film forming apparatus is achieved by shortening the time when a substrate is separated from a substrate adsorption member (electrostatic chuck). The film forming apparatus for forming a film on a film forming surface of the substrate via a mask is characterized by comprising: a substrate support unit for supporting the film forming surface side of the substrate; a substrate adsorption member having an adsorption surface that adsorbs a non-film-forming surface on the opposite side of the film-forming surface of the substrate; a mask suction member that is disposed on the opposite side of the mask with the substrate suction member therebetween and that pulls the mask toward the film formation surface; and a pressing part which is provided on the mask suction member and extends toward the substrate adsorption member in a direction intersecting the non-film-formation surface, and which,