Robot system, robot controlling method, and semiconductor manufacturing system
A robot system, a robot controlling method, and a semiconductor manufacturing system are provided which are capable of reducing the pivoting radius while ensuring the elongation of the arm. The robot includes: a first arm (17) that is a horizontal multi-joint type arm provided with a first base link...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A robot system, a robot controlling method, and a semiconductor manufacturing system are provided which are capable of reducing the pivoting radius while ensuring the elongation of the arm. The robot includes: a first arm (17) that is a horizontal multi-joint type arm provided with a first base link provided to be rotatable around a pivoting axis (AX0), a first intermediate link, and a first hand (21) that holds a workpiece, and configured to move the first hand along a first diameter direction (D1) centered on the pivoting axis; a second arm (19) that is a horizontal multi-joint type arm provided with a second base link provided to be independently rotatable from the first base link around the pivoting axis, a second intermediate link, and a second hand (23) that holds the workpiece, and configured to move the second hand along a second diameter direction (D2) having a predetermined angle around the pivoting axis with respect to the first diameter direction; and a pivoting device (24) configured to pivot the |
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