3D THERMOFORMED ELEMENT
The invention relates to a three-dimensional vacuum thermal insulation element (1) comprising: a compressed three-dimensional porous structure (5); and a shell (7) closed in an airtight manner, comprising a thermoformable barrier wall (7a) and enclosing the porous structure which is arranged between...
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Zusammenfassung: | The invention relates to a three-dimensional vacuum thermal insulation element (1) comprising: a compressed three-dimensional porous structure (5); and a shell (7) closed in an airtight manner, comprising a thermoformable barrier wall (7a) and enclosing the porous structure which is arranged between two major surfaces of said barrier wall (7a), and in which, at ambient external temperature and pressure, there is a pressure of between less than 105 Pa and more than 10-2Pa, characterized in that the barrier wall (7a) is thermoformed at the site of said two major surfaces, between which the porous structure (5) has a curved shape and/or reliefs and/or depressions.
本发明涉及一种三维真空隔热元件(1),其包括:压缩的三维多孔结构(5),以气密方式封闭的封皮(7),所述封皮包括可热成形的阻隔壁(7a)并且围封所述多孔结构,所述多孔结构插置在所述阻隔壁(7a)的两个主表面之间,并且在所述封皮中,在外部环境温度和压力下,介于小于105Pa与大于10-2Pa之间的压力占优势,其特征在于,所述阻隔壁(7a)在所述两个主表面处热成形,在所述两个主表面之间,所述多孔结构(5)被弯曲成形和/或具有凸起和/或凹陷。 |
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