Copper paste and chip multilayer ceramic capacitor

The invention discloses copper paste which comprises an organic carrier, copper powder, glass powder, an inorganic auxiliary agent and a dispersing agent. The inorganic auxiliary agent is at least one of CuO, Cu2O, ZnO, TiO2 and SrO, and the weight percentage content of the inorganic auxiliary agent in the copper paste is 0.5 to 5%. The weight percentage of the glass powder in the copper paste is 2 to 10%. The inorganic auxiliary agent is added into the copper paste, so that the reaction degree of the copper paste and an MLCC dielectric layer can be improved. The invention further discloses a preparation method of the copper paste. The invention further discloses a chip multilayer ceramic capacitor using the copper paste. The end-capped MLCC prepared from the copper paste has no defects of sagging, pinholes and the like in appearance, after sintering at 700 to 850 DEG C, the surface is compact, nickelizing is avoided in the electroplating process, the thickness of an interface reaction layer is 1 to 5 microns