Method for manufacturing electrode foil for electrolytic capacitor
Provided is a method for manufacturing an electrode foil for an electrolytic capacitor, comprising an electrolytic etching step for etching a metal foil by applying a current to at least one main surface of the metal foil in an etching solution. The electrolytic etching step includes: a first step o...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Provided is a method for manufacturing an electrode foil for an electrolytic capacitor, comprising an electrolytic etching step for etching a metal foil by applying a current to at least one main surface of the metal foil in an etching solution. The electrolytic etching step includes: a first step of etching the metal foil from the start of etching of the metal foil until 30% of a total time T during which the metal foil is etched elapses; and a second step in which, after the first step, the metal foil is etched. In the first step, the current density of the current flowing through the metal foil reaches the maximum current density A1. In the second step, the current density of the current flowing through the metal foil is 10% or more and 30% or less of the maximum current density A1 for 50% or more of the total time T.
本发明提供一种电解电容器用电极箔的制造方法,包括:电解蚀刻工序,在蚀刻液中,在金属箔的至少一个主面流过电流来对所述金属箔进行蚀刻。所述电解蚀刻工序包括:第1步骤,从所述金属箔的蚀刻开始起至经过所述金属箔被蚀刻的总时间T的30%的时间为止,对所述金属箔进行蚀刻;和第2步骤,在所述第1步骤之后,对所述金属箔进行蚀刻。在所述第1步骤中,流过所述金属箔的电流的电流密度达到最大电流密度A1 |
---|