Electroplating device and electroplating method capable of controlling electric quantity of workpiece

The invention discloses an electroplating device and an electroplating method capable of controlling the electric quantity of a workpiece. The electroplating device comprises an electroplating bath, an anode arranged in the electroplating bath, a rotating device arranged on the upper side of the electroplating bath, a hanger rack connected with the rotating device, a circuit control device and a plurality of circuit board hangers which are arranged at the lower end of the hanger rack and extend into the electroplating bath, wherein a plurality of hanging points are arranged on the circuit board hangers; each hanging point is electrically connected with one electronic assembly switch; and each electronic assembly switch is electrically connected with the circuit control device through a rotary conducting ring. According to the electroplating device capable of controlling the electric quantity of the workpiece, the electric quantity threshold value of each electronic assembly switch is configured, the accumulat