Silica particle, resin composition, resin film, and metal-clad laminate
Provided are: a silica particle capable of achieving an improvement in dielectric properties without impairing mechanical properties such as bending property; a resin composition having improved dielectric properties by adding the silica particle; a resin film; and a metal-clad laminate. The silica...
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| creator | TANAKA MUTSUHITO FUJIMA ORIHIDO HIRAISHI KATSUFUMI DEAI HIROYUKI WANG HONGYUAN |
| description | Provided are: a silica particle capable of achieving an improvement in dielectric properties without impairing mechanical properties such as bending property; a resin composition having improved dielectric properties by adding the silica particle; a resin film; and a metal-clad laminate. The silica particle is used in the frequency range of 3-20 GHz, and has an average particle diameter (D50) in the range of 0.3-3 [mu]m, when the accumulative value measured by particle size distribution curve obtained by a laser diffraction and scattering method is 50%, and a specific surface area in the range of 5-20 m2/g, the dielectric loss tangent measured by a resonant cavity perturbation method is 0.004 or less. The resin composition contains the silica particle and polyamic acid or polyimide, and the content of the silica particle is in the range of 30-70 vol% with respect to the polyamic acid or the polyimide.
本发明提供一种能够在不损害弯折性等机械特性的情况下实现介电特性的改善的二氧化硅粒子以及通过添加所述二氧化硅粒子而介电特性得到改善的树脂组合物、树脂膜及覆金属层叠板。二氧化硅粒子用于3GHz～20GHz的频率范围中，通过 |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN112745529A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN112745529A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN112745529A3</originalsourceid><addsrcrecordid>eNqNyrEKwkAMgOFbHKT6DnFvh1aLOEqpOrnoXkKaQiCXO3p5f1x0d_rh49-G-0tUCCHj6kLKNaxcxIBSzKmIS7IfLaKxBrQZIjtqQ4ozKEYxdN6FzYJaeP9tFQ638T08Gs5p4pKR2Nin4dm23fnU993levzn-QAgKDNT</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Silica particle, resin composition, resin film, and metal-clad laminate</title><source>esp@cenet</source><creator>TANAKA MUTSUHITO ; FUJIMA ORIHIDO ; HIRAISHI KATSUFUMI ; DEAI HIROYUKI ; WANG HONGYUAN</creator><creatorcontrib>TANAKA MUTSUHITO ; FUJIMA ORIHIDO ; HIRAISHI KATSUFUMI ; DEAI HIROYUKI ; WANG HONGYUAN</creatorcontrib><description>Provided are: a silica particle capable of achieving an improvement in dielectric properties without impairing mechanical properties such as bending property; a resin composition having improved dielectric properties by adding the silica particle; a resin film; and a metal-clad laminate. The silica particle is used in the frequency range of 3-20 GHz, and has an average particle diameter (D50) in the range of 0.3-3 [mu]m, when the accumulative value measured by particle size distribution curve obtained by a laser diffraction and scattering method is 50%, and a specific surface area in the range of 5-20 m2/g, the dielectric loss tangent measured by a resonant cavity perturbation method is 0.004 or less. The resin composition contains the silica particle and polyamic acid or polyimide, and the content of the silica particle is in the range of 30-70 vol% with respect to the polyamic acid or the polyimide.
本发明提供一种能够在不损害弯折性等机械特性的情况下实现介电特性的改善的二氧化硅粒子以及通过添加所述二氧化硅粒子而介电特性得到改善的树脂组合物、树脂膜及覆金属层叠板。二氧化硅粒子用于3GHz～20GHz的频率范围中，通过</description><language>chi ; eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210504&DB=EPODOC&CC=CN&NR=112745529A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210504&DB=EPODOC&CC=CN&NR=112745529A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANAKA MUTSUHITO</creatorcontrib><creatorcontrib>FUJIMA ORIHIDO</creatorcontrib><creatorcontrib>HIRAISHI KATSUFUMI</creatorcontrib><creatorcontrib>DEAI HIROYUKI</creatorcontrib><creatorcontrib>WANG HONGYUAN</creatorcontrib><title>Silica particle, resin composition, resin film, and metal-clad laminate</title><description>Provided are: a silica particle capable of achieving an improvement in dielectric properties without impairing mechanical properties such as bending property; a resin composition having improved dielectric properties by adding the silica particle; a resin film; and a metal-clad laminate. The silica particle is used in the frequency range of 3-20 GHz, and has an average particle diameter (D50) in the range of 0.3-3 [mu]m, when the accumulative value measured by particle size distribution curve obtained by a laser diffraction and scattering method is 50%, and a specific surface area in the range of 5-20 m2/g, the dielectric loss tangent measured by a resonant cavity perturbation method is 0.004 or less. The resin composition contains the silica particle and polyamic acid or polyimide, and the content of the silica particle is in the range of 30-70 vol% with respect to the polyamic acid or the polyimide.
本发明提供一种能够在不损害弯折性等机械特性的情况下实现介电特性的改善的二氧化硅粒子以及通过添加所述二氧化硅粒子而介电特性得到改善的树脂组合物、树脂膜及覆金属层叠板。二氧化硅粒子用于3GHz～20GHz的频率范围中，通过</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwkAMgOFbHKT6DnFvh1aLOEqpOrnoXkKaQiCXO3p5f1x0d_rh49-G-0tUCCHj6kLKNaxcxIBSzKmIS7IfLaKxBrQZIjtqQ4ozKEYxdN6FzYJaeP9tFQ638T08Gs5p4pKR2Nin4dm23fnU993levzn-QAgKDNT</recordid><startdate>20210504</startdate><enddate>20210504</enddate><creator>TANAKA MUTSUHITO</creator><creator>FUJIMA ORIHIDO</creator><creator>HIRAISHI KATSUFUMI</creator><creator>DEAI HIROYUKI</creator><creator>WANG HONGYUAN</creator><scope>EVB</scope></search><sort><creationdate>20210504</creationdate><title>Silica particle, resin composition, resin film, and metal-clad laminate</title><author>TANAKA MUTSUHITO ; FUJIMA ORIHIDO ; HIRAISHI KATSUFUMI ; DEAI HIROYUKI ; WANG HONGYUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112745529A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>TANAKA MUTSUHITO</creatorcontrib><creatorcontrib>FUJIMA ORIHIDO</creatorcontrib><creatorcontrib>HIRAISHI KATSUFUMI</creatorcontrib><creatorcontrib>DEAI HIROYUKI</creatorcontrib><creatorcontrib>WANG HONGYUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANAKA MUTSUHITO</au><au>FUJIMA ORIHIDO</au><au>HIRAISHI KATSUFUMI</au><au>DEAI HIROYUKI</au><au>WANG HONGYUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Silica particle, resin composition, resin film, and metal-clad laminate</title><date>2021-05-04</date><risdate>2021</risdate><abstract>Provided are: a silica particle capable of achieving an improvement in dielectric properties without impairing mechanical properties such as bending property; a resin composition having improved dielectric properties by adding the silica particle; a resin film; and a metal-clad laminate. The silica particle is used in the frequency range of 3-20 GHz, and has an average particle diameter (D50) in the range of 0.3-3 [mu]m, when the accumulative value measured by particle size distribution curve obtained by a laser diffraction and scattering method is 50%, and a specific surface area in the range of 5-20 m2/g, the dielectric loss tangent measured by a resonant cavity perturbation method is 0.004 or less. The resin composition contains the silica particle and polyamic acid or polyimide, and the content of the silica particle is in the range of 30-70 vol% with respect to the polyamic acid or the polyimide.
本发明提供一种能够在不损害弯折性等机械特性的情况下实现介电特性的改善的二氧化硅粒子以及通过添加所述二氧化硅粒子而介电特性得到改善的树脂组合物、树脂膜及覆金属层叠板。二氧化硅粒子用于3GHz～20GHz的频率范围中，通过</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | Silica particle, resin composition, resin film, and metal-clad laminate |
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