Silica particle, resin composition, resin film, and metal-clad laminate

Provided are: a silica particle capable of achieving an improvement in dielectric properties without impairing mechanical properties such as bending property; a resin composition having improved dielectric properties by adding the silica particle; a resin film; and a metal-clad laminate. The silica particle is used in the frequency range of 3-20 GHz, and has an average particle diameter (D50) in the range of 0.3-3 [mu]m, when the accumulative value measured by particle size distribution curve obtained by a laser diffraction and scattering method is 50%, and a specific surface area in the range of 5-20 m2/g, the dielectric loss tangent measured by a resonant cavity perturbation method is 0.004 or less. The resin composition contains the silica particle and polyamic acid or polyimide, and the content of the silica particle is in the range of 30-70 vol% with respect to the polyamic acid or the polyimide. 本发明提供一种能够在不损害弯折性等机械特性的情况下实现介电特性的改善的二氧化硅粒子以及通过添加所述二氧化硅粒子而介电特性得到改善的树脂组合物、树脂膜及覆金属层叠板。二氧化硅粒子用于3GHz～20GHz的频率范围中，通过