Printed circuit board, and printing method and debugging method of printed circuit board

The invention provides a printed circuit board, and a printing method and a debugging method of the printed circuit board. Bonding pads of the preset specification of the printed circuit board at least comprise a first bonding pad and a second bonding pad which are oppositely arranged, and an electrical gap between the two bonding pads is relatively short. The first bonding pad and the second bonding pad can be short-circuited in the form of tin connection during early-stage testing and verification, a zero-ohm function is realized, and the first bonding pad and the second bonding pad can be disconnected or connected with other components by removing the tin connection through soldering iron in the later-stage use process. Therefore, the influence on the production efficiency due to the use of a large amount of zero-ohm resistors during the early-stage design of the circuit board is avoided, the damage to the circuit board due to the use of short bonding pads is reduced, design and use are facilitated, and th