Light epoxy resin composition for semiconductor packaging

The invention provides a light epoxy resin composition for semiconductor packaging. The light epoxy resin composition comprises the following components in parts by weight: 4-25 parts of epoxy resin A; 4-25 parts of a curing agent B; 0.02-3 part of an accelerant C; 10-89 parts of an inorganic filler...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LU XUKUI, LI ZHENG, WANG HANJIE, FENG ZHUOXING, WANG SHANXUE, LI HAILIANG, LI GANG, CHANG ZHIGUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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