Light epoxy resin composition for semiconductor packaging

The invention provides a light epoxy resin composition for semiconductor packaging. The light epoxy resin composition comprises the following components in parts by weight: 4-25 parts of epoxy resin A; 4-25 parts of a curing agent B; 0.02-3 part of an accelerant C; 10-89 parts of an inorganic filler D; 0.05-3 part of a release agent E; 0.01-3 part of a coupling agent F; 0.01-3 part of a high-temperature expansion microsphere G; and 0.1-0.5 part of carbon black. The light epoxy resin composition has the following technical effects: after molding, curing is carried out for 4-8 hours at 175 DEG C, the weight can be reduced by 7.76%-9.6% compared with that of the conventional molding compound, and the light epoxy resin composition is especially suitable for semiconductor packaging devices with important requirements. 本发明提供了一种半导体封装用轻质环氧树脂组合物，所述的轻质环氧树脂组合物，按照重量份包括如下组份：环氧树脂A，4-25份；固化剂B，4-25份；促进剂C，0.02-3份；无机填料D，10-89份；脱模剂E，0.05-3份；偶联剂F，0.01-3份；高温膨胀微球G,0.01-3份；炭黑，0.1-0.5份。本发明具有如下技术效果：成型后经175℃后固化4-8小时处理后与常规塑封料相比重量可减轻7.7