Light epoxy resin composition for semiconductor packaging
The invention provides a light epoxy resin composition for semiconductor packaging. The light epoxy resin composition comprises the following components in parts by weight: 4-25 parts of epoxy resin A; 4-25 parts of a curing agent B; 0.02-3 part of an accelerant C; 10-89 parts of an inorganic filler...
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| creator | LU XUKUI LI ZHENG WANG HANJIE FENG ZHUOXING WANG SHANXUE LI HAILIANG LI GANG CHANG ZHIGUO |
| description | The invention provides a light epoxy resin composition for semiconductor packaging. The light epoxy resin composition comprises the following components in parts by weight: 4-25 parts of epoxy resin A; 4-25 parts of a curing agent B; 0.02-3 part of an accelerant C; 10-89 parts of an inorganic filler D; 0.05-3 part of a release agent E; 0.01-3 part of a coupling agent F; 0.01-3 part of a high-temperature expansion microsphere G; and 0.1-0.5 part of carbon black. The light epoxy resin composition has the following technical effects: after molding, curing is carried out for 4-8 hours at 175 DEG C, the weight can be reduced by 7.76%-9.6% compared with that of the conventional molding compound, and the light epoxy resin composition is especially suitable for semiconductor packaging devices with important requirements.
本发明提供了一种半导体封装用轻质环氧树脂组合物，所述的轻质环氧树脂组合物，按照重量份包括如下组份：环氧树脂A，4-25份；固化剂B，4-25份；促进剂C，0.02-3份；无机填料D，10-89份；脱模剂E，0.05-3份；偶联剂F，0.01-3份；高温膨胀微球G,0.01-3份；炭黑，0.1-0.5份。本发明具有如下技术效果：成型后经175℃后固化4-8小时处理后与常规塑封料相比重量可减轻7.7 |
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本发明提供了一种半导体封装用轻质环氧树脂组合物，所述的轻质环氧树脂组合物，按照重量份包括如下组份：环氧树脂A，4-25份；固化剂B，4-25份；促进剂C，0.02-3份；无机填料D，10-89份；脱模剂E，0.05-3份；偶联剂F，0.01-3份；高温膨胀微球G,0.01-3份；炭黑，0.1-0.5份。本发明具有如下技术效果：成型后经175℃后固化4-8小时处理后与常规塑封料相比重量可减轻7.7</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210430&DB=EPODOC&CC=CN&NR=112724897A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210430&DB=EPODOC&CC=CN&NR=112724897A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LU XUKUI</creatorcontrib><creatorcontrib>LI ZHENG</creatorcontrib><creatorcontrib>WANG HANJIE</creatorcontrib><creatorcontrib>FENG ZHUOXING</creatorcontrib><creatorcontrib>WANG SHANXUE</creatorcontrib><creatorcontrib>LI HAILIANG</creatorcontrib><creatorcontrib>LI GANG</creatorcontrib><creatorcontrib>CHANG ZHIGUO</creatorcontrib><title>Light epoxy resin composition for semiconductor packaging</title><description>The invention provides a light epoxy resin composition for semiconductor packaging. The light epoxy resin composition comprises the following components in parts by weight: 4-25 parts of epoxy resin A; 4-25 parts of a curing agent B; 0.02-3 part of an accelerant C; 10-89 parts of an inorganic filler D; 0.05-3 part of a release agent E; 0.01-3 part of a coupling agent F; 0.01-3 part of a high-temperature expansion microsphere G; and 0.1-0.5 part of carbon black. The light epoxy resin composition has the following technical effects: after molding, curing is carried out for 4-8 hours at 175 DEG C, the weight can be reduced by 7.76%-9.6% compared with that of the conventional molding compound, and the light epoxy resin composition is especially suitable for semiconductor packaging devices with important requirements.
本发明提供了一种半导体封装用轻质环氧树脂组合物，所述的轻质环氧树脂组合物，按照重量份包括如下组份：环氧树脂A，4-25份；固化剂B，4-25份；促进剂C，0.02-3份；无机填料D，10-89份；脱模剂E，0.05-3份；偶联剂F，0.01-3份；高温膨胀微球G,0.01-3份；炭黑，0.1-0.5份。本发明具有如下技术效果：成型后经175℃后固化4-8小时处理后与常规塑封料相比重量可减轻7.7</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD0yUzPKFFILcivqFQoSi3OzFNIzs8tyC_OLMnMz1NIyy9SKE7NzUzOz0spTS4B8goSk7MT0zPz0nkYWNMSc4pTeaE0N4Oim2uIs4cu0Kz41GKgutS81JJ4Zz9DQyNzIxMLS3NHY2LUAACHii9f</recordid><startdate>20210430</startdate><enddate>20210430</enddate><creator>LU XUKUI</creator><creator>LI ZHENG</creator><creator>WANG HANJIE</creator><creator>FENG ZHUOXING</creator><creator>WANG SHANXUE</creator><creator>LI HAILIANG</creator><creator>LI GANG</creator><creator>CHANG ZHIGUO</creator><scope>EVB</scope></search><sort><creationdate>20210430</creationdate><title>Light epoxy resin composition for semiconductor packaging</title><author>LU XUKUI ; LI ZHENG ; WANG HANJIE ; FENG ZHUOXING ; WANG SHANXUE ; LI HAILIANG ; LI GANG ; CHANG ZHIGUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112724897A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>LU XUKUI</creatorcontrib><creatorcontrib>LI ZHENG</creatorcontrib><creatorcontrib>WANG HANJIE</creatorcontrib><creatorcontrib>FENG ZHUOXING</creatorcontrib><creatorcontrib>WANG SHANXUE</creatorcontrib><creatorcontrib>LI HAILIANG</creatorcontrib><creatorcontrib>LI GANG</creatorcontrib><creatorcontrib>CHANG ZHIGUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LU XUKUI</au><au>LI ZHENG</au><au>WANG HANJIE</au><au>FENG ZHUOXING</au><au>WANG SHANXUE</au><au>LI HAILIANG</au><au>LI GANG</au><au>CHANG ZHIGUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light epoxy resin composition for semiconductor packaging</title><date>2021-04-30</date><risdate>2021</risdate><abstract>The invention provides a light epoxy resin composition for semiconductor packaging. The light epoxy resin composition comprises the following components in parts by weight: 4-25 parts of epoxy resin A; 4-25 parts of a curing agent B; 0.02-3 part of an accelerant C; 10-89 parts of an inorganic filler D; 0.05-3 part of a release agent E; 0.01-3 part of a coupling agent F; 0.01-3 part of a high-temperature expansion microsphere G; and 0.1-0.5 part of carbon black. The light epoxy resin composition has the following technical effects: after molding, curing is carried out for 4-8 hours at 175 DEG C, the weight can be reduced by 7.76%-9.6% compared with that of the conventional molding compound, and the light epoxy resin composition is especially suitable for semiconductor packaging devices with important requirements.
本发明提供了一种半导体封装用轻质环氧树脂组合物，所述的轻质环氧树脂组合物，按照重量份包括如下组份：环氧树脂A，4-25份；固化剂B，4-25份；促进剂C，0.02-3份；无机填料D，10-89份；脱模剂E，0.05-3份；偶联剂F，0.01-3份；高温膨胀微球G,0.01-3份；炭黑，0.1-0.5份。本发明具有如下技术效果：成型后经175℃后固化4-8小时处理后与常规塑封料相比重量可减轻7.7</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | Light epoxy resin composition for semiconductor packaging |
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