COVER TAPE AND PACKAGING BODY FOR PACKAGING ELECTRONIC COMPONENT

The present disclosure provides a cover tape for packaging an electronic component, the cover tape having: a substrate layer; a heat-seal layer which is disposed on one surface side of the substrate layer and includes an ethylene-vinyl acetate copolymer; and an antistatic layer which is disposed on...

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Bibliographische Detailangaben
Hauptverfasser:	INOUE MASAKUNI, NAGATSUKA YASUNORI, TSUKIYAMA KAZUKI, MIYACHI TAKAKI, HAGIO HIRONORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present disclosure provides a cover tape for packaging an electronic component, the cover tape having: a substrate layer; a heat-seal layer which is disposed on one surface side of the substrate layer and includes an ethylene-vinyl acetate copolymer; and an antistatic layer which is disposed on the opposite surface side of the surface of the heat-seal layer of the substrate layer and includes a conductive polymer, wherein the Vickers hardness of the heat-seal layer is a predetermined value or greater. 本发明提供一种电子部件包装用盖带，其具有：基材层；热封层，其配置于上述基材层的一面侧，且包含乙烯-乙酸乙烯酯共聚物；及抗静电层，其配置于上述基材层的与上述热封层侧的面相反的面侧，且包含导电性高分子；上述热封层的维氏硬度为规定值以上。