Semiconductor device

Semiconductor devices and methods of forming the same are provided. In one embodiment, a semiconductor device includes a redistribution layer including a first conductive feature and a second conductive feature, a first contact feature disposed over and electrically coupled to the first conductive feature, a second contact feature disposed over and electrically coupled to the second conductive feature, and a protective member extending from between the first conductive member and the second conductive member to between the first contact member and the second contact member. The passivation feature includes a dielectric feature and a dielectric layer. The dielectric layer is disposed on a planar top surface of the dielectric feature, and the composition of the dielectric feature is different from the composition of the dielectric layer. 本发明实施例提供半导体装置及其形成方法。在一实施例中，一种半导体装置包括重分配层，重分配层包括第一导电部件及第二导电部件；第一接触部件设置在第一导电部件之上，并电性耦合至第一导电部件；第二接触部件设置在第二导电部件之上，并电性耦合至第二导电部件；以及保护部件，保护部件从第一导电部件与第二导电部件之间延伸至第一接触部件与第二接触部件之间。保护部件包括介