Preparation method of insulator pin and insulator pin

The invention is applicable to the technical field of semiconductors, and provides a preparation method of an insulator pin and the insulator pin, and the method comprises the following steps: respectively preparing a plurality of via holes arranged in an array mode on an upper substrate and a lower substrate, and sputtering seed layers on the surfaces of the upper substrate and the lower substrate and in the via holes; electroplating metal with preset height on the upper surface and the lower surface in the via holes of the upper substrate and the lower substrate of the sputtering seed layer in a layer-by-layer electroplating manner; etching off the seed layers of the non-electroplated areas on the electroplated upper substrate and the electroplated lower substrate; preparing protective layers on the etched metal surfaces of the upper substrate and the lower substrate; and correspondingly bonding a first enclosing wall of the upper substrate for preparing the protective layer and a third enclosing wall of th