WAFER PROCESSING METHOD

The invention provides a wafer processing method which can form a device chip without reducing the quality. The wafer processing method is used for dividing a wafer, in which a plurality of devices are formed in each region of a front surface divided by division lines, into individual device chips,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARAKAWA TARO, KIUCHI HAYATO, YODO YOSHIAKI, MIYAI TOSHITERU, OHMAE MAKIKO, AGARI MASAMITSU, FUJII YUSUKE, MATSUZAWA MINORU, KAWAMURA EMIKO, HARADA SHIGENORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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