WAFER PROCESSING METHOD

The invention provides a wafer processing method which can form a device chip without reducing the quality. The wafer processing method is used for dividing a wafer, in which a plurality of devices are formed in each region of a front surface divided by division lines, into individual device chips, and comprises a polyolefin-based wafer positioning step for positioning the wafer in an opening of a frame having an opening for accommodating the wafer, and disposing a polyolefin-based sheet on the back surface or the front surface of the wafer and the outer periphery of the frame; an integration step in which the polyolefin-based sheet is heated, and a wafer and the frame are integrated by thermocompression bonding via the polyolefin-based sheet; a dividing step in which a laser beam having a wavelength that is permeable to the wafer is irradiated onto the wafer along the planned dividing line, a shield tunnel is formed in the wafer, and the wafer is divided into individual device chips; and a pickup step in whi