Resin hole plugging method for PCB

The invention relates to the technical field of circuit boards, in particular to a resin hole plugging method for a PCB. The method comprises the following steps: S1, compacting the PCB; S2, drilling holes in the PCB, so that layers can be communicated with one another; S3, copper deposition I, performing copper deposition on a hole in the PCB; S4, primary copper I, electroplating the wall surfaces of the holes in the PCB; S5, outer layer I, electroplating the hole wall needing resin hole plugging; S6, secondary copper I, electroplating the hole wall needing resin hole plugging, and ensuring that the thickness of hole copper is greater than or equal to 30 microns; S7, resin hole plugging by filling the holes needing resin hole plugging with resin, and ensuring that the concave depth of the resin is less than 10 microns; and S8, grinding and copper reduction, specifically, grinding the surfaces of the resin protrusions to be flat, and carrying out copper reduction on the surface of hole copper of the hole wall