Abrasive cutting wheel and preparation method thereof

The invention discloses an abrasive cutting wheel. The abrasive cutting wheel is mainly prepared from the following raw materials of, in parts by volume: 45-52 parts of epoxy resin, 15-25 parts of diamond, 7-10 parts of fused SiO2, 10-15 parts of Al2O3 micro powder and 0.5 part of carbon black. The...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LI DASHUI, DU XIAOXU, WANG SILIANG, YANG SONGCAN, HAO SUYE, WANG QINGWEI, WU LEITAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses an abrasive cutting wheel. The abrasive cutting wheel is mainly prepared from the following raw materials of, in parts by volume: 45-52 parts of epoxy resin, 15-25 parts of diamond, 7-10 parts of fused SiO2, 10-15 parts of Al2O3 micro powder and 0.5 part of carbon black. The abrasive cutting wheel can be produced on a large scale, is mainly used for cutting glass, ceramic, semiconductor packaging and other materials, a preparation speed of the abrasive cutting wheel can be increased, and meanwhile the service life of the abrasive cutting wheel can be prolonged (the service life can be prolonged by 34% or above). 本发明涉及一种切割砂轮,其主要由下述体积份数的原料制成:环氧树脂45-52份、金刚石15-25份、熔凝型SiO2 7-10份、Al2O3微粉10-15份、炭黑0.5份。该切割砂轮能够实现大批量生产,主要用于玻璃、陶瓷、半导体封装等材料的切割,能够提升砂轮的制备速度,同时提高砂轮的使用寿命(使用寿命能够提高34%以上)。