Method for realizing 90 DEG bending of semi-flexible PCB

The invention discloses a method for realizing 90 DEG bending of a semi-flexible PCB. The method comprises the following steps: 1, determining the depth and the width of a bending groove 3 obtained by performing fixed-depth milling on the middle part of the semi-flexible PCB; 2, manufacturing a semi...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	GAO WENDE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!