Method for realizing 90 DEG bending of semi-flexible PCB

The invention discloses a method for realizing 90 DEG bending of a semi-flexible PCB. The method comprises the following steps: 1, determining the depth and the width of a bending groove 3 obtained by performing fixed-depth milling on the middle part of the semi-flexible PCB; 2, manufacturing a semi...

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1. Verfasser: GAO WENDE
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a method for realizing 90 DEG bending of a semi-flexible PCB. The method comprises the following steps: 1, determining the depth and the width of a bending groove 3 obtained by performing fixed-depth milling on the middle part of the semi-flexible PCB; 2, manufacturing a semi-flexible PCB, wherein the semi-flexible PCB comprises a plurality of circuit layers 1, and the circuit layers 1 are connected with one another through PP layers 2; and when the semi-flexible PCB is manufactured, placing a blocking flat plate 4 at the bottom of the bending groove 3, wherein the width of the blocking flat plate 4 is the same as that of the bending groove 3, and the blocking flat plate 4 is positioned in the PP layer 2; 3, performing depth setting milling on the semi-flexible PCB through a drilling machine to obtain a bent groove 3, and stopping depth setting milling when a drill bit of the drilling machine touches the blocking flat plate 4; and 4, taking out the blocking flat plate 4 from the bendin