ANTIBACTERIAL SHEET AND METHOD FOR MANUFACTURING SAME

An antibacterial sheet (1) includes a resin film (2) and copper particles (3) adhering to at least one surface of the resin film (2). The total light beam transmittance of the antibacterial sheet (1) at wavelengths of 380 to 780 nm is 20% or more. The average circle equivalent diameter of the copper...

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Bibliographische Detailangaben
Hauptverfasser:	NOSE KENJI, KOISHIKAWA ATSUSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	An antibacterial sheet (1) includes a resin film (2) and copper particles (3) adhering to at least one surface of the resin film (2). The total light beam transmittance of the antibacterial sheet (1) at wavelengths of 380 to 780 nm is 20% or more. The average circle equivalent diameter of the copper particles (3) is 10 to 30 nm. The adhesion amount of the copper particles (3) is 100 to 200 mg/[mu]m2. The antibacterial sheet (1) can be manufactured by, for example, a method in which vacuum deposition is conducted under a pressure controlled to within a range of 1 * 10 to 1 *10 Pa, to deposit the copper particles (3) on the resin film (2). 抗菌片材(1)具有树脂膜(2)和附着于树脂膜(2)的至少单面的铜颗粒(3)。波长380～780nm下的抗菌片材(1)的总透光率为20％以上。铜颗粒(3)的平均圆当量直径为10～30nm。铜颗粒(3)的附着量为100～200mg/μm2。抗菌片材(1)例如可以通过如下方法制作：将压力控制在1×10-4～1×10-2Pa的范围内进行真空蒸镀、在树脂膜(2)上形成铜颗粒(3)。