Rapid glue removing device for positioning holes of PCBs and for electrical engineering

The invention relates to a glue removing device, in particular to a rapid glue removing device for positioning holes of PCBs and for electrical engineering. The rapid glue removing device for the positioning holes of the PCBs and for electrical engineering is high in PCB glue removing efficiency and...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	ZHENG ZONGJIAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a glue removing device, in particular to a rapid glue removing device for positioning holes of PCBs and for electrical engineering. The rapid glue removing device for the positioning holes of the PCBs and for electrical engineering is high in PCB glue removing efficiency and capable of achieving feeding quite conveniently. The rapid glue removing device for the positioning holes of the PCBs and for electrical engineering comprises a base, a clamping mechanism and a glue removing mechanism. The clamping mechanism is arranged on the base. The glue removing mechanism is arranged on the clamping mechanism. According to the rapid glue removing device, the effect of rapidly removing redundant glue in the positioning holes of the PCBs is achieved, through cooperation of the glue removing mechanism, a glue scraping mechanism and an adsorption mechanism, the redundant glue on the surfaces of the PCBs and in the positioning holes of the PCBs can be automatically taken out, the glue removing eff