Board edge structure for improving PCB warping

The invention relates to the technical field of PCB manufacturing, and discloses a board edge structure for improving PCB warping, which comprises a process edge and a plurality of unit boards, wherein connecting boards are arranged between the unit boards and the process edge, the unit boards are a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI JUN, LUO XIANGTAO, XIA YUNZHOU, TANG XIANQU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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