Board edge structure for improving PCB warping

The invention relates to the technical field of PCB manufacturing, and discloses a board edge structure for improving PCB warping, which comprises a process edge and a plurality of unit boards, wherein connecting boards are arranged between the unit boards and the process edge, the unit boards are arranged along the length direction of the process edge, and copper layers are arranged at the upper end and the lower end of the process edge. Compared with the prior art, the copper layers are arranged at the upper end and the lower end of the process edge, so that the process edge can uniformly share stress, warping is effectively reduced, and the connection strength of the PCB can be improved due to the arrangement of the copper layers. The connecting board between the process edge and the unit board is not provided with a copper layer, so that the stress of the process edge is difficult to transfer to the unit board through the connecting board, and the warping of the unit board can be effectively reduced. The