SEMICONDUCTOR DEVICE USING WIRES AND STACKED SEMICONDUCTOR PACKAGE

The invention provides a semiconductor device using wires and a stacked semiconductor package. Disclosed are a semiconductor device and a stacked semiconductor package. The semiconductor device may include a semiconductor chip and a plurality of chip pads disposed on the semiconductor chip in a second horizontal direction perpendicular to a first horizontal direction. The plurality of chip pads may include: a first chip pad connected to a wire extending in the first horizontal direction, when seen from the top; and a second chip pad connected to a diagonal wire extending in a direction at an angle to the first and second horizontal directions, when seen from the top. The width of the first chip pad in the second horizontal direction may be smaller than the width of the second chip pad in the second horizontal direction. 使用引线的半导体装置和层叠半导体封装。公开了一种半导体装置和层叠半导体封装。该半导体装置可包括半导体芯片以及在与第一水平方向垂直的第二水平方向上设置在半导体芯片上的多个芯片焊盘。所述多个芯片焊盘可包括：第一芯片焊盘，其连接到当从顶部看时在第一水平方向上延伸的引线；以及第二芯片焊盘，其连接到对角引线，当从顶部看时所述对角引线在与第一水平方向和第二水平方向成角度的方向上延伸。第一芯片焊