POLYAMIDE COMPOSITIONS AND PLATING APPLICATIONS THEREOF

The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form aesthetic injection-molded articles. The polyamide compositions may include from 45 wt.% to 75 wt.% of an polyamide, from 2 wt.% to 40 wt.% of an etchable...

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Bibliographische Detailangaben
Hauptverfasser: WHITE KIMBERLY M, RAY JACOB G, POWERS SCOTT E, SPARKS BRADLEY JAMES
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form aesthetic injection-molded articles. The polyamide compositions may include from 45 wt.% to 75 wt.% of an polyamide, from 2 wt.% to 40 wt.% of an etchable filler, from 10 wt.% to 40 wt.% of a semi-structural mineral, and optionally from 0.1 wt.% to 13 wt.% of additive. The polyamide composition imparts very good surface appearance to injection-molded articles that are substantially free of visual defects. 本公开涉及聚酰胺组合物和所得注射成型制品,所述制品可镀,例如可金属涂布,以形成美观的注射成型制品。所述聚酰胺组合物可包括45重量%至75重量%的聚酰胺、2重量%至40重量%的可蚀刻填料、10重量%至40重量%的半结构矿物和任选0.1重量%至13重量%的添加剂。所述聚酰胺组合物赋予注射成型制品极好的表面外观以使其基本没有视觉缺陷。