Semiconductor structure
A semiconductor structure is provided. The semiconductor structure comprises a first conductive feature embedded within a first dielectric layer, a via disposed over the first conductive feature, a second conductive feature disposed over the via, and a graphene layer disposed over at least a portion...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A semiconductor structure is provided. The semiconductor structure comprises a first conductive feature embedded within a first dielectric layer, a via disposed over the first conductive feature, a second conductive feature disposed over the via, and a graphene layer disposed over at least a portion of the first conductive feature. The via electrically couples the first conductive feature to the second conductive feature.
提供半导体结构。半导体结构包括第一导电结构,埋置于第一介电层中;通孔结构,位于第一导电结构上;第二导电结构,位于通孔结构上;以及石墨烯层,位于第一导电结构的至少一部分上。通孔结构电性耦接第一导电结构至第二导电结构。 |
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