POTTING COMPOUND, METHOD FOR ELECTRICALLY ISOLATING ELECTRICAL OR ELECTRONIC COMPONENT, AND ELECTRICALLY ISOLATED COMPONENT

The invention relates to a potting compound. Said potting compound contains 5.0-30.0 wt.% reactive particles, selected from magnesium oxide particles with a maximum particle size of 5.0 um, porous magnesium oxide particle agglomerates, silicon oxide particles with a maximum particle size of 0.5 um, silica particles with a maximum particle size of 0.5 um and mixtures thereof, 45.0-90.0 wt.% fillerparticles with a particle size exceeding 1 um and/or filler fibres, and 5.0-20.0 wt.% water. The component is potted using the potting compound (11) in a method for electrically isolating an electrical or electronic component. Said component is then heat-treated at a temperature ranging from 50 DEG C to 95 DEG C in an atmosphere saturated with water (12) and dried. An electrically isolated component can be produced in this way. 本发明涉及灌封料。其包含5.0-30.0重量％的反应性颗粒，该反应性颗粒选自粒径为最大5.0µm的氧化镁颗粒、多孔氧化镁颗粒附聚物、粒径为最大0.5µm的氧化硅颗粒、粒径为最大0.5µm的硅酸颗粒及其混合物，45.0-90.0重量％的粒径大于1µm的填料颗粒和/或填料纤维，和5.0-20.0重量％的水。在用于使电气或电子部件电绝缘的方法中，用该灌封料灌封（11）该部件。随后在水饱和的