Transfer method and transfer device for micro light-emitting diode
The embodiment of the invention provides a transfer method and a transfer device of a micro light emitting diode. The transfer method comprises the following steps of manufacturing an expandable material unit at one side of at least one micro light-emitting diode grain on at least one substrate base...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention provides a transfer method and a transfer device of a micro light emitting diode. The transfer method comprises the following steps of manufacturing an expandable material unit at one side of at least one micro light-emitting diode grain on at least one substrate base material to obtain at least one micro light-emitting diode transfer body; exciting the expandable material unit in at least part of the micro light-emitting diode transfer body to expand; adsorbing at least part of the micro light-emitting diode transfer body on the substrate base material to a transfer substrate; releasing at least part of the micro light-emitting diode transfer bodies located on the transfer substrate to a target substrate; and removing each expandable material unit in the light emitting diode transfer body of the target substrate. According to the embodiment of the invention, the spacing of the micro light-emitting diode grains in the transfer process is adjustable, so that the preparation effi |
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