Non-selective wet etching method of multilayer material and application thereof

The invention relates to the technical field of micromachining wet etching, and particularly discloses a non-selective wet etching method of a multilayer material and application thereof. According tothe method, a step-by-step corrosion method is adopted, a substrate of a multi-layer structure is co...

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Hauptverfasser: YAO WENGANG, DONG FENGXIN, ZHAO RUN, WU YANQING, CHE XIANGHUI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to the technical field of micromachining wet etching, and particularly discloses a non-selective wet etching method of a multilayer material and application thereof. According tothe method, a step-by-step corrosion method is adopted, a substrate of a multi-layer structure is corroded to the target depth in stages, and after corrosion of the previous stage is finished, the substrate is taken out, the surface of the substrate is washed with deionized water, and then the next corrosion stage is executed; the adopted non-selective wet etching solution is a mixed solution ofa hydrogen bromide solution, hydrogen peroxide and water in a volume ratio of 1.9-2.1: 1: 14-16, the concentration of the hydrogen bromide solution is 40-45wt%, and the concentration of the hydrogen peroxide is 30-35wt%. By means of the corrosion method, the corrosion rates of different material layers can be kept consistent, the end faces of the different material layers are smooth and free of steps after corrosion, and m