Method for processing a metallic component surface to achieve lower electrical contact resistance

The invention provides a method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/ cm2 and 5 billion cm2. 本发明提供一种用于处理金属部件表面以达到较低的接触电阻的方法。该方法包括改变表面化学组成，以及在金属部件表面产生包括小峰或者凹坑的微纹理表面结构。小峰和凹坑具有直径在10纳米和10微米之间。小峰和凹坑是圆形或不规则的横截面形状，小峰和凹坑高度或深度在10纳米和10微米之间，分布密度在40万/cm2到50亿/cm2之间。