BENZOXAZINE COMPOUND, CURABLE RESIN COMPOSITION, ADHESIVE, ADHESIVE FILM, CURED OBJECT, CIRCUIT BOARD, INTERLAYER DIELECTRIC MATERIAL, AND MULTILAYERED PRINTED WIRING BOARD

A purpose of the present invention is to provide a benzoxazine compound usable in a curable resin composition which has excellent pliability before curing and has excellent dielectric properties aftercuring. Another purpose of the present invention is to provide: a curable resin composition containi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WAKIOKA SAYAKA, OATARI YUTA, KAWAHARA YUKO, TAKEDA KOHEI, HAYASHI TATSUSHI, SHINDO MASAMI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HETEROCYCLIC COMPOUNDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A purpose of the present invention is to provide a benzoxazine compound usable in a curable resin composition which has excellent pliability before curing and has excellent dielectric properties aftercuring. Another purpose of the present invention is to provide: a curable resin composition containing the benzoxazine compound; and an adhesive, adhesive film, cured object, circuit board, interlayer dielectric material, and multilayered printed wiring board each comprising or obtained using the curable resin composition. The benzoxazine compound of the present invention includes, in the molecule, both a benzoxazine ring and a diamine residue having a C4 or higher aliphatic skeleton and/or a triamine residue having a C4 or higher aliphatic skeleton. 本发明的目的在于提供能够用于固化前挠性优异、固化后介电特性优异的固化性树脂组合物的苯并噁嗪化合物。另外，本发明的目的在于提供包含该苯并噁嗪化合物的固化性树脂组合物、使用该固化性树脂组合物而成的粘接剂、粘接膜、固化物、电路基板、层间绝缘材料及多层印刷布线板。本发明的苯并噁嗪化合物在分子中具有：具有碳原子数为4以上的脂肪族骨架的二胺残基和/或具有碳原子数为4以上的脂肪族骨架的三胺残基、以及苯并噁嗪环。