LAMINATED STRUCTURE, FLEXIBLE COPPER FOIL LAMINATED FILM, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE

Disclosed are a laminated structure, a flexible copper foil laminated film including same, and a method for manufacturing said laminated structure. The laminated structure comprises: a non-conductivepolymer substrate; a nickel-containing plating layer disposed on at least one surface of the substrate; and a first copper plating layer disposed on the nickel-containing plating layer, wherein X-raydiffraction (XRD) analysis of the first copper plating layer shows a [111] crystal plane, and the peeling rate per a unit area of 1 cm2 between the non-conductive polymer substrate and the nickel-containing plating layer may be 1% or less. 公开层压结构、包含该层压结构的柔性铜箔层叠膜、及制造该层压结构的方法。该层压结构包含：一不导电聚合物基板：一含镍镀层，其经定位于该基板之至少一个表面上；及一第一铜镀层，其经定位于该含镍镀层上，其中藉由对该第一铜镀层执行之X射线绕射(XRD,X-ray diffraction)分析而观察到[111]定向平面，且该不导电聚合物基板与该含镍镀层之间之每1cm2单位面积之一分层速率为1％或更小。