Method for plating metal on ceramic side wall
The invention discloses a method for plating metal on a ceramic side wall. The method comprises the following steps of (1) opening a hole; (2) surface metallizing; (3) pasting a dry film, specifically, a pattern is made, and bottom copper is exposed out of a through hole or a blind hole where side w...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method for plating metal on a ceramic side wall. The method comprises the following steps of (1) opening a hole; (2) surface metallizing; (3) pasting a dry film, specifically, a pattern is made, and bottom copper is exposed out of a through hole or a blind hole where side wall metal needs to be made; (4) metal thickening; (5) stripping and etching to obtain a pattern; (6)cutting, specifically, the cutting position where the side wall needs to be made, and the cutting width during cutting cannot be larger than the size of the hole; and (7) grounding burrs on the sideedges, and obtaining the side wall metal. According to the method for plating metal on the ceramic side wall, the blind hole or the through hole is made in a ceramic chip, a seed metal layer is made on the blind hole/through hole, electroplating thickening is conducted, cutting is conducted finally, the process is simple, mass production is easy, sintering or die manufacturing is not needed, the cost is equivalent to that |
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