Preparation method of aluminum nitride ceramic circuit board

The invention discloses a preparation method of an aluminum nitride ceramic circuit board, which comprises the following steps of 1) editing a circuit pattern in circuit board editing software, 2) transferring an edited pattern file into laser engraving machine software, 3) putting an aluminum nitride ceramic chip with a cleaned surface on a laser engraving machine, setting parameters, using a laser engraving machine for scanning a circuit diagram on the surface of the aluminum nitride ceramic and forming a decomposition layer, wherein the set parameters comprise scanning power (0-100W), scanning speed (0-1000mm/s) and scanning distance (0.01-1 mm), and the cleaned aluminum nitride ceramic chip comprises the processes of oil removal, impurity removal, water washing and drying, 4) carryingout chemical copper plating on the carved aluminum nitride ceramic chip, and then carrying out chemical silver (or gold) plating, and 5) cleaning, drying, sealing and storing the silver-plated or gold-plated circuit board for