Die bonding method for LED chip

The invention relates to the technical field of LED manufacturing, and discloses a die bonding method for an LED chip. The method comprises the steps of S1, cleaning a to-be-die-bonded support, and drying the to-be-die-bonded support, S2, forming a solder paste layer in the die bonding area of the t...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WU QIANPING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!