Die bonding method for LED chip

The invention relates to the technical field of LED manufacturing, and discloses a die bonding method for an LED chip. The method comprises the steps of S1, cleaning a to-be-die-bonded support, and drying the to-be-die-bonded support, S2, forming a solder paste layer in the die bonding area of the to-be-die-bonded support, wherein the particle size of the solder powder in the solder paste layer is1-5 microns, S3, pasting an LED chip on the surface of the solder paste layer by using a die bonder, S4, placing the to-be-die-bonded support pasted with the chip in an oven with the temperature of 95-110 DEG C for baking for 10-18 minutes, S5, quickly transferring the baked to-be-die-bonded support from the oven to a heating table at 185-195 DEG C, and heating until the solder paste is molten, and S6, removing the to-be-die-bonded support from the heating table and cooling to solidify the solder paste. According to the die bonding method for the LED chip, the micron-sized solder paste is adopted to carry out die bon