Antenna chip packaging structure and preparation method thereof

The invention provides an antenna chip packaging structure and a preparation method thereof, and the preparation method comprises the steps: providing a first supporting substrate, and forming a rewiring layer; sequentially forming a first antenna layer, a first connecting structure and a first pack...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	XUE YAYUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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