Antenna chip packaging structure and preparation method thereof

The invention provides an antenna chip packaging structure and a preparation method thereof, and the preparation method comprises the steps: providing a first supporting substrate, and forming a rewiring layer; sequentially forming a first antenna layer, a first connecting structure and a first packaging layer on the rewiring layer; sequentially forming a second antenna layer, a second connectingstructure and a second packaging layer above the first packaging layer; forming a third antenna layer above the second packaging layer; bonding a second supporting substrate above the second packaginglayer and the third antenna layer; removing the first support substrate, and forming an under bump metal layer below the rewiring layer; and forming a solder ball and a connecting chip on the under bump metal layer. According to the invention, by introducing the multi-layer antenna layer structure, the size of the packaging structure is reduced; laser drilling is adopted, so that the through holeforming process is high in