BOARD HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
A board having an electronic component embedded therein, includes a core layer having a groove with a bottom surface, an electronic component disposed above the bottom surface of the groove and spacedapart from the bottom surface of the groove, and an insulating layer disposed on the core layer and...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A board having an electronic component embedded therein, includes a core layer having a groove with a bottom surface, an electronic component disposed above the bottom surface of the groove and spacedapart from the bottom surface of the groove, and an insulating layer disposed on the core layer and covering at least a portion of the electronic component. The insulating layer is disposed in at least a portion of a space between the bottom surface of the groove and the electronic component.
本发明提供一种嵌有电子组件的板,所述嵌有电子组件的板包括:芯层,具有带有底表面的槽;电子组件,设置在所述槽的所述底表面上方并且与所述槽的所述底表面间隔开;以及绝缘层,设置在所述芯层上并且覆盖所述电子组件的至少一部分。所述绝缘层设置在所述槽的所述底表面与所述电子组件之间的空间的至少一部分中。 |
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