Interconnect Clip with Angled Contact Surface and Raised Bridge
An interconnect clip includes a die contact portion having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a bridge portion adjoining the die contactportion and having substantially planar upper and lower surfaces that are parallel to and opposite fr...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | An interconnect clip includes a die contact portion having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a bridge portion adjoining the die contactportion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a lead contact portion adjoining the bridge portion and having a lead contact surface or contact point, and a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends along a second plane that is completely above the first plane throughout a complete length ofthe bridge portion. The lead contact surface or contact point is disposed below the first plane.
一种互连夹具包括:管芯接触部分,其包括彼此平行且相对的基本平坦的上表面和下表面;桥部分,其邻接管芯接触部分并且包括彼此平行且相对的基本平坦的上表面和下表面;引线接触部分,其邻接桥部分并且具有引线接触表面或接触点。管芯接触部分的下表面沿着第一平面延伸。桥部分 |
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