INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN

An integrated circuit device includes a wiring structure, first and second inter-wiring insulating layers, redistributions patterns and a cover insulating layer. The wiring structure includes wiring layers having a multilayer wiring structure and via plugs. The first inter-wiring insulating layer surrounds the wiring structure on a substrate. The second inter-wiring insulating layer is on the first inter-wiring insulating layer, and redistribution via plugs are connected to the wiring structure through the second inter-wiring insulating layer. The redistribution patterns includes pad patternsand dummy patterns on the second inter-wiring insulating layer. Each pattern has a thickness greater than a thickness of each wiring layer. The cover insulating layer covers some of the redistributionpatterns. The dummy patterns are in the form of lines that extend in a horizontal direction parallel to the substrate. 一种集成电路装置包括布线结构、第一布线间绝缘层、第二布线间绝缘层、再分布图案和覆盖绝缘层。布线结构包括具有多层布线结构的布线层和通孔插塞。第一布线间绝缘层围绕基板上的布线结构。第二布线间绝缘层在第一布线间绝缘层上