TEXTURED BOND PADS

The invention relates to textured bond pads. In some examples, a package comprises a semiconductor die and a bond pad (202) formed upon the semiconductor die. The bond pad has a protrusion (410) on atop surface (203) of the bond pad. The package also comprises a metal contact and a bond wire coupled...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RABILAS JR ANICETO TABANGCURA, GUEVARA RAFAEL JOSE LIZARES, SANCHEZ SYLVESTER TIGNO, DE ASIS RAY FREDRIC SOLIS, ANDAYA ALVIN LOPEZ
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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