TEXTURED BOND PADS

TEXTURED BOND PADS

The invention relates to textured bond pads. In some examples, a package comprises a semiconductor die and a bond pad (202) formed upon the semiconductor die. The bond pad has a protrusion (410) on atop surface (203) of the bond pad. The package also comprises a metal contact and a bond wire coupled...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RABILAS JR ANICETO TABANGCURA, GUEVARA RAFAEL JOSE LIZARES, SANCHEZ SYLVESTER TIGNO, DE ASIS RAY FREDRIC SOLIS, ANDAYA ALVIN LOPEZ
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention relates to textured bond pads. In some examples, a package comprises a semiconductor die and a bond pad (202) formed upon the semiconductor die. The bond pad has a protrusion (410) on atop surface (203) of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact. 本申请题为"纹理化键合焊盘"。在一些示例中，一种封装件包括半导体管芯和形成在半导体管芯上的键合焊盘(202)。该键合焊盘具有在键合焊盘的顶表面(203)上的突起部(410)。该封装件还包括金属接触件以及耦合到突起部和金属接触件的键合线。