Electronic device and manufacturing method thereof

The invention discloses an electronic device and a method of manufacturing the same. The electronic device includes a first flexible substrate, a bonding pad and a first supporting diaphragm, whereinthe bonding pad is located on the first flexible substrate, and the first supporting diaphragm is con...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ZENG YUZHI, HUANG XINHAO, LAI GUIHONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention discloses an electronic device and a method of manufacturing the same. The electronic device includes a first flexible substrate, a bonding pad and a first supporting diaphragm, whereinthe bonding pad is located on the first flexible substrate, and the first supporting diaphragm is connected to the first flexible substrate; and the first supporting diaphragm is also provided with afirst opening disposed corresponding to the bonding pad. 本发明公开一种电子装置以及一种制造一电子装置的方法，其中，该电子装置包括第一可挠基板、接合垫以及第一支撑膜片。接合垫位于第一可挠基板上，又第一支撑膜片连接至第一可挠基板。第一支撑膜片还具有对应于接合垫而设置的第一开口。