Semiconductor chip POLISHING PAD CONDITIONING APPARATUS

A semiconductor chip polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber. 一种用于修整半导体晶片抛光垫的装置包括基底、纤维及从基底的表面突出且包围纤维的聚合物。

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Bibliographische Detailangaben
Hauptverfasser:	CHEN SHIZHONG, CHEN HONGLIN, CHEN ZHENGBING, PENG SHENGTAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	A semiconductor chip polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber. 一种用于修整半导体晶片抛光垫的装置包括基底、纤维及从基底的表面突出且包围纤维的聚合物。