Memory device including circuit system under bonding pad

The present invention relates to a memory device including a circuit system under a bonding pad. Some embodiments include apparatuses and methods of fabricating the apparatuses. One of the apparatusesincludes a substrate of a semiconductor die; a memory cell portion located over a first portion of the substrate; a conductive pad portion located over a second portion of the substrate and outside the memory cell portion; and a sensor circuit including a portion located over the second portion of the substrate and under the conductive pad portion. The conductive pad portion includes conductive pads. Each of the conductive pads is part of a respective electrical path coupled to a conductive contact of a base outside the substrate. 本申请案涉及包含结合衬垫下方的电路系统的存储器装置。一些实施例包含设备和制造所述设备的方法。所述设备中的一个包含：半导体裸片的衬底；存储器单元部分，其位于所述衬底的第一部分上方；导电衬垫部分，其位于所述衬底的第二部分上方和所述存储器单元部分外部；以及传感器电路，其包含位于所述衬底的所述第二部分上方和所述导电衬垫部分下方的部分。所述导电衬垫部分包含导电衬垫。所述导电衬垫中的每一个是耦合到所述衬底外部的基底的导电触点的相应电路径的部分。