BUBBLE JETTING METHOD, POWER SUPPLY DEVICE, AND DEVICE FOR JETTING BUBBLES

Provided are: a bubble jetting method based on a new principle; a power-supply device for implementing said bubble jetting method; and a device for jetting bubbles. The present invention is capable ofjetting bubbles by means of this method for jetting bubbles to a conductor, the method comprising: a step for bringing a bubble generation electrode into contact with the conductor; a step for bringing a counter electrode into contact with the conductor or an object to be processed; and a step for applying a negative voltage to the bubble generation electrode, wherein a conductor material is exposed at least at the leading end of the bubble generation electrode. 提供一种基于新原理的气泡喷出方法、用于实施该气泡喷出方法的电源装置、以及气泡喷出用装置。能够通过气泡喷出方法来喷出气泡，所述气泡喷出方法向导电体喷出气泡，该气泡喷出方法包括如下工序：使气泡发生用电极与导电体接触；使对置电极与导电体或加工对象物接触；以及对所述气泡发生用电极施加负电压，所述气泡发生用电极的至少前端部露出导电性材料。