Photosensitive component, camera module and preparation method thereof

The invention relates to a photosensitive component and a camera module and a preparation method thereof. The photosensitive assembly comprises a photosensitive chip and a circuit board, wherein the circuit board comprises a circuit board main body and an ink layer formed on the circuit board main body. And the ink layer comprises a hollow area formed in a photosensitive chip mounting area of thecircuit board. The hollowed-out area is configured to apply an adhesive to the hollowed-out area, so that the photosensitive chip is bent downwards in the process that the photosensitive chip is attached to the circuit board through the adhesive. In this way, the bending state of the photosensitive chip is adjusted to improve the imaging quality of the photosensitive chip. 本申请涉及一种感光组件及其摄像模组和制备方法。该感光组件包括感光芯片和线路板，所述线路板包括线路板主体和形成于所述线路板主体的油墨层。所述油墨层包括形成于所述线路板的感光芯片安装区域的镂空区域。所述镂空区域配置为施加黏着剂于其上，以通过所述黏着剂使得在感光芯片贴装于所述线路板的过程中所述感光芯片向下弯曲。这样，调整所述感光芯片的弯曲状态以提高其成像质量。